Die (integrated circuit)

Source: Wikipedia, the free encyclopedia.
Die of LM2576T monolithic integrated circuits step−down switching regulator (buck converter) which contains 162 active transistors (based on datasheet). The Biggest part of die on the left side is Built-in 3 Ampere power transistor and the damaged and fried part of die is clearly visible as a small black in power transistor section.
LM2576T monolithic integrated circuit die

A die, in the context of

diced
) into many pieces, each containing one copy of the circuit. Each of these pieces is called a die.

1-watt red power LED die

There are three commonly used plural forms: dice, dies, and die.[1][2] To simplify handling and integration onto a printed circuit board, most dies are packaged in various forms.

Manufacturing process

Main article: Semiconductor device fabrication

Most dies are composed of silicon and used for integrated circuits. The process begins with the production of monocrystalline silicon ingots. These ingots are then sliced into disks with a diameter of up to 300 mm.[3][4]

Typical NPN transistor. Size of die is roughly 1 mm × 1 mm.

These wafers are then polished to a mirror finish before going through photolithography. In many steps the transistors are manufactured and connected with metal interconnect layers. These prepared wafers then go through wafer testing to test their functionality. The wafers are then sliced and sorted to filter out the faulty dies. Functional dies are then packaged and the completed integrated circuit is ready to be shipped.

Uses

A die can host many types of circuits. One common use case of an integrated circuit die is in the form of a

LED lighting to power semiconductor devices
.

Images

  • Single NPN bipolar junction transistor die
    Single NPN bipolar junction transistor die
  • Die of an infrared receiver
    Die of an infrared receiver
  • Close-up of an RGB light-emitting diode, showing the three individual dies
    Close-up of an
    RGB light-emitting diode
    , showing the three individual dies
  • A small-scale integrated-circuit die, with bond wires attached
    A small-scale integrated-circuit die, with
    bond wires
    attached
  • A VLSI integrated-circuit die
    A VLSI integrated-circuit die
  • Two dies bonded onto one chip carrier
    Two dies bonded onto one chip carrier
  • A monolithic IC operational amplifier
    A monolithic IC operational amplifier
  • 3 1/2 Digit Single Chip A/D Converter
    3 1/2 Digit Single Chip A/D Converter
  • SN7400 Quad NAND gate in flat pack package. 1965.
    SN7400 Quad NAND gate in flat pack package. 1965.
  • CD-ROM Drive head die
    CD-ROM Drive head die
  • An old security camera CCD sensor
    An old security camera CCD sensor
  • 1 watt 9 volt SMD LED.
    1 watt 9 volt SMD LED.
  • 6-volt 3-watt power LED. Wire bonds damaged in removing phosphor.
    6-volt 3-watt power LED. Wire bonds damaged in removing phosphor.

See also

References

  1. ISBN 0-8493-1951-X. Archived
    from the original on 2017-01-31.
  2. ISBN 0-12-226930-6
    .
  3. ^ From Sand to Silicon “Making of a Chip” | Intel. (YouTube video, streamed on Nov 6, 2009)
  4. ^ From Sand to Silicon “Making of a Chip” Illustrations. (n.d.)

External links

Wikimedia Commons has media related to Integrated circuit dies.
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