Electroless copper plating

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Electroless copper plating is a chemical process that deposits an even layer of copper on the surface of a solid substrate, like metal or plastic. The process involves dipping the substrate in a water solution containing copper salts and a reducing agent such as formaldehyde.[1]

Unlike

conductive
surfaces.

Process

In a typical formulation of the process, the surfaces to be coated are primed with a

catalyst and then immersed in a bath containing copper ions Cu2+, which are reduced by formaldehyde through the overall reactions[citation needed
]

2HCHO + 2OH−
 → 3H
2 (gas) + 2CO
2 + 2e-
Cu2+
 + 2e- → Cu (metal).

Applications

Plated PCB via types: (1) through hole, (2) blind via, (3) buried via.

Electroless copper plating is used in the manufacture of printed circuit boards (PCBs), in particular for the conductive layer on the walls of through holes and vias.[3]

See also

References

  1. ISBN 9780936569079
  2. ^ Thomas Publishing Company (2020): "The Electro Nickel Plating Process". Online article at the Thomasnet.com website. Accessed on 2020-07-11.
  3. ^ Baudrand, Don. "Electroplating/Electroless Plating for Electronic Applications". Products Finishing. Retrieved September 30, 2022.
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