User:Jcarroll/Dr. Fred Barlow

Title

Advancements in

Electronic Packaging

Abstract

Demand for increased performance and functionality in electronic products continues to increase. These trends coupled with a desire for reduced product form factors continue to create significant challenges for electronic packaging. Some of the challenges include higher operating speeds, signal integrity, as well as the need to incorporate thinned die, die stacks, and increased requirements for thermal management. This presentation will provide an overview of the trends in electronic packaging with a particular emphasis on high-speed digital products.

In addition, this presentation will describe the newly expanded microelectronics program at the Moscow campus of the

microelectronic device fabrication

. Both of these course offer undergraduate and graduate sections and are available via the Internet through the Educational Outreach office.

Bio

Fred Barlow earned a Bachelors of Science in Physics and Applied Physics from

IMAPS), and editor in chief of the Journal of Microelectronics and Electronic Packaging

.