Bumpless Build-up Layer

Bumpless Build-up Layer or BBUL is a

. The usual way is to manufacture them separately and bond them together.

It was presented in October 2001. It should have been a key component in the 8 GHz and 15 GHz processors that should have been in the market by 2005 and 2007 respectively.^[1] Also 20 GHz should have been possible before the year 2010.^{[citation needed]} The BBUL is not needed yet^[when?] because there is no longer the clock-frequency competition.

Advantages

• Thinner and lighter.
• Higher performance and lower power.
• Higher interconnect density. C4 bumps were reaching their limits.
• Better signal routing capability.
• Allows many chips in the same package.

External links

• BBUL Packaging
• Intel to delay Bumpless Build-up Layer processor package
• Bumpless Build-Up Layer Packaging

References