High-electron-mobility transistor
A high-electron-mobility transistor (HEMT or HEM FET), also known as heterostructure FET (HFET) or modulation-doped FET (MODFET), is a
equipment. They are widely used in satellite receivers, in low power amplifiers and in the defense industry.Applications
The applications of HEMTs include
HEMTs are suitable for applications where high gain and low noise at high frequencies are required, as they have shown current gain to frequencies greater than 600 GHz and power gain to frequencies greater than 1THz.[1] Gallium nitride based HEMTs are used as power switching transistors for voltage converter applications due to their low on-state resistances, low switching losses, and high breakdown strength.[2][3] These gallium nitride enhanced voltage converter applications include AC adapters, which benefit from smaller package sizes due to the power circuitry requiring smaller passive electronic components.[3]
History
The invention of the high-electron-mobility transistor (HEMT) is usually attributed to physicist Takashi Mimura (三村 高志), while working at
Independently, Daniel Delagebeaudeuf and Tranc Linh Nuyen, while working at Thomson-CSF in France, filed a patent for a similar type of field-effect transistor in March 1979. It also cites the Bell Labs patent as an influence.[7] The first demonstration of an "inverted" HEMT was presented by Delagebeaudeuf and Nuyen in August 1980.[4]
One of the earliest mentions of a GaN-based HEMT is in the 1993 Applied Physics Letters article, by Khan et al.
Operation
Field effect transistors whose operation relies on the formation of a two-dimensional electron gas (
Advantages
The advantages of HEMTs over other transistor topologies like the Bipolar junction transistor and the MOSFET are higher operating temperatures of GaN-based HEMTs compared to Si-based MOSFETS,[10] higher breakdown strengths in the case of GaN-based HEMTs versus Si-based MOSFETS, lower specific on-state resistances when comparing GaN-based HEMTs to Si-based MOSFETs,[3] and low noise performance/higher switching speeds in the case of InP HEMTs.[13]
2DEG channel creation
The wide band element is doped with donor atoms; thus it has excess electrons in its conduction band. These electrons will diffuse to the adjacent narrow band material’s conduction band due to the availability of states with lower energy. The movement of electrons will cause a change in potential and thus an electric field between the materials. The electric field will push electrons back to the wide band element’s conduction band. The diffusion process continues until electron diffusion and electron drift balance each other, creating a junction at equilibrium similar to a p–n junction. Note that the undoped narrow band gap material now has excess majority charge carriers. The fact that the charge carriers are majority carriers yields high switching speeds, and the fact that the low band gap semiconductor is undoped means that there are no donor atoms to cause scattering and thus yields high mobility.
In the case of GaAs HEMTs, they make use of high mobility electrons generated using the heterojunction of a highly doped wide-bandgap n-type donor-supply layer (AlGaAs in our example) and a non-doped narrow-bandgap channel layer with no dopant impurities (GaAs in this case). The electrons generated in the thin n-type AlGaAs layer drop completely into the GaAs layer to form a depleted AlGaAs layer, because the heterojunction created by different band-gap materials forms a
Electrostatic mechanism
Since GaAs has higher
- Trapping of free electrons by surface states causes the surface depletion.
- Transfer of electrons into the undoped GaAs layer brings about the interface depletion.
The
Modulation doping in HEMTs
An important aspect of HEMTs is that the band discontinuities across the conduction and valence bands can be modified separately. This allows the type of carriers in and out of the device to be controlled. As HEMTs require electrons to be the main carriers, a graded doping can be applied in one of the materials, thus making the conduction band discontinuity smaller and keeping the valence band discontinuity the same. This diffusion of carriers leads to the accumulation of electrons along the boundary of the two regions inside the narrow band gap material. The accumulation of electrons leads to a very high current in these devices. The term "
Manufacture
MODFETs can be manufactured by
Versions of HEMTs
By growth technology: pHEMT and mHEMT
Ideally, the two different materials used for a heterojunction would have the same lattice constant (spacing between the atoms). In practice, the lattice constants are typically slightly different (e.g. AlGaAs on GaAs), resulting in crystal defects. As an analogy, imagine pushing together two plastic combs with a slightly different spacing. At regular intervals, you'll see two teeth clump together. In semiconductors, these discontinuities form deep-level traps and greatly reduce device performance.
A HEMT where this rule is violated is called a pHEMT or pseudomorphic HEMT. This is achieved by using an extremely thin layer of one of the materials – so thin that the crystal lattice simply stretches to fit the other material. This technique allows the construction of transistors with larger
Another way to use materials of different lattice constants is to place a buffer layer between them. This is done in the mHEMT or metamorphic HEMT, an advancement of the pHEMT. The buffer layer is made of
By electrical behaviour: eHEMT and dHEMT
HEMTs made of semiconductor hetero-interfaces lacking interfacial net polarization charge, such as AlGaAs/GaAs, require positive gate voltage or appropriate donor-doping in the AlGaAs barrier to attract the electrons towards the gate, which forms the 2D electron gas and enables conduction of electron currents. This behaviour is similar to that of commonly used field-effect transistors in the enhancement mode, and such a device is called enhancement HEMT, or eHEMT.
When a HEMT is built from
Induced HEMT
In contrast to a modulation-doped HEMT, an induced high electron mobility transistor provides the flexibility to tune different electron densities with a top gate, since the charge carriers are "induced" to the
References
- ^ "Northrop Grumman sets record with terahertz IC amplifier". www.semiconductor-today.com.
- ^ .
- ^ ISBN 9781315215426.
- ^ .
- ^ US 4163237, Ray Dingle, Arthur Gossard and Horst Störmer, "High mobility multilayered heterojunction devices employing modulated doping"
- S2CID 3112776. Archived from the original(PDF) on 8 March 2019.
- ^ US 4471366, Daniel Delagebeaudeuf and Tranc L. Nuyen, "Field effect transistor with high cut-off frequency and process for forming same" (Google Patents)
- doi:10.1063/1.109775.
- ISSN 0129-1564.
- ^ hdl:11380/1255364.
- ISBN 978-981-33-4866-0.
- .
- .
- ^ "Indium Phosphide: Transcending frequency and integration limits. Semiconductor TODAY Compounds&AdvancedSilicon • Vol. 1 • Issue 3 • September 2006" (PDF).
- ISSN 2227-9040.