Quilt packaging

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3x3 Chip Array Using Quilt Packaging Interconnect Technology

QP Chiplets can be quilted together in most any orientation.

Quilt Packaging (QP) is an integrated circuit packaging and chip-to-chip interconnect packaging technology that utilizes “nodule” structures that extend out horizontally from the edges of microchips to make chip-to-chip interconnections.^[1][2] 

QP nodules are created as an integral part of a microchip using standard back end of the line techniques in semiconductor device fabrication. Solder is then electroplated on top of the nodules to enable the chip to chip interconnection with sub-micron alignment accuracy.^[3]

Small high yielding “

QP interconnects have a achieved 12 gigabit/sec (Gbps) bit-rate throughput with no distortion with 10 µm nodules on a 10 µm pitch on the edge of the chip.^[7]

Optics/Photonics

Preliminary optical coupling loss simulations and measurements indicate that inter-chip coupling loss is < 6 dB for a gap of less than 4 µm.  Loss rapidly improves as the gap approaches zero, which is achievable with Quilt Packaging assembly tolerances.^[8][9]

References