Cray-2
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Cray Research | |
Type | Supercomputer |
---|---|
Release date | 1985 |
Discontinued | 1990 |
Units sold | 25 |
CPU | Custom Vector Processors |
Predecessor | Cray X-MP |
The Cray-2 is a
The Cray-2 was the first of Seymour Cray's designs to successfully use multiple CPUs. This had been attempted in the CDC 8600 in the early 1970s, but the emitter-coupled logic (ECL) transistors of the era were too difficult to package into a working machine. The Cray-2 addressed this through the use of ECL integrated circuits, packing them in a novel 3D wiring that greatly increased circuit density.
The dense packaging and resulting heat loads were a major problem for the Cray-2. This was solved in a unique fashion by forcing the electrically inert Fluorinert liquid through the circuitry under pressure and then cooling it outside the processor box. The unique "waterfall" cooler system came to represent high-performance computing in the public eye and was found in many informational films and as a movie prop for some time.
Unlike the original Cray-1, the Cray-2 had difficulties delivering peak performance. Other machines from the company, like the X-MP and Y-MP, outsold the Cray-2 by a wide margin. When Cray began development of the Cray-3, the company chose to develop the Cray C90 series instead. This is the same sequence of events that occurred when the 8600 was being developed, and as in that case, Cray left the company.
Initial design
With the successful launch of his famed
Cray had previously attacked the problem of increased speed with three simultaneous advances: more functional units to give the system higher parallelism, tighter packaging to decrease signal delays, and faster components to allow for a higher clock speed. The classic example of this design is the
One solution to this problem, one that most computer vendors had already moved to, was to use integrated circuits (ICs) instead of individual components. Each IC included a selection of components from a module pre-wired into a circuit by the automated construction process. If an IC did not work, another one would be tried. At the time the 8600 was being designed the simple MOSFET-based technology did not offer the speed Cray needed. Relentless improvements changed things by the mid-1970s, however, and the Cray-1 had been able to use newer ICs and still run at a respectable 12.5 ns (80 MHz). In fact, the Cray-1 was actually somewhat faster than the 8600 because it packed considerably more logic into the system due to the ICs' small size.
Although IC design continued to improve, the physical size of the ICs was constrained largely by mechanical limits; the resulting component had to be large enough to solder into a system. Dramatic improvements in density were possible, as the rapid improvement in microprocessor design was showing, but for the type of ICs used by Cray, ones representing a very small part of a complete circuit, the design had plateaued. In order to gain another 10-fold increase in performance over the Cray-1, the goal Cray aimed for, the machine would have to grow more complex. So once again he turned to an 8600-like solution, doubling the clock speed through increased density, adding more of these smaller processors into the basic system, and then attempting to deal with the problem of getting heat out of the machine.
Another design problem was the increasing performance gap between the processor and
To avoid this problem the new design banked memory and two sets of registers (the B- and T-registers) were replaced with a 16
Main memory banks were arranged in quadrants to be accessed at the same time, allowing programmers to scatter their data across memory to gain higher parallelism. The downside to this approach is that the cost of setting up the scatter/gather unit in the foreground processor was fairly high. Stride conflicts corresponding to the number of memory banks suffered a performance penalty (latency) as occasionally happened in power-of-2 FFT-based algorithms. As the Cray 2 had a much larger memory than Cray 1s or X-MPs, this problem was easily rectified by adding an extra unused element to an array to spread the work out.
Packed circuit boards and new design ideas
Early Cray-2 models soon settled on a design using large circuit boards packed with ICs. This made them extremely difficult to solder together, and the density was still not enough to reach their performance goals. Teams worked on the design for about two years before even Cray himself "gave up" and decided it would be best if they simply canceled the project and fired everyone working on it. Les Davis, Cray's former design collaborator who had remained at Cray headquarters, decided it should be continued at low priority. After some minor personnel movements, the team continued on much as before.
Six months later Cray had his "eureka" moment. He called the main engineers together for a meeting and presented a new solution to the problem. Instead of making one larger circuit board, each "card" would instead consist of a 3-D stack of eight, connected together in the middle of the boards using pins sticking up from the surface (known as "pogos" or "z-pins"). The cards were packed right on top of each other, so the resulting stack was only about 30 mm high.
With this sort of density there was no way any conventional air-cooled system would work; there was too little room for air to flow between the ICs. Instead the system would be immersed in a tank of a new inert liquid from 3M, Fluorinert. The cooling liquid was forced sideways through the modules under pressure, and the flow rate was roughly one inch per second. The heated liquid was cooled using chilled water heat exchangers and returned to the main tank. Work on the new design started in earnest in 1982, several years after the original start date.
While this was going on the Cray X-MP was being developed under the direction of Steve Chen at Cray headquarters, and looked like it would give the Cray-2 a serious run for its money. In order to address this internal threat, as well as a series of newer Japanese Cray-1-like machines, the Cray-2 memory system was dramatically improved, both in size as well as the number of "pipes" into the processors. When the machine was eventually delivered in 1985, the delays had been so long that much of its performance benefits were due to the faster memory. Purchasing the machine really made sense only for users with huge data sets to process.
The first Cray-2 delivered possessed more physical memory (256 MWord) than all previously delivered Cray machines combined. Simulation moved from a 2-D realm or coarse 3-D to a finer 3-D realm because computation did not have to rely on slow virtual memory.
Uses and successors
The Cray-2 was predominantly developed for the
The Cray-2 would have been superseded by the Cray-3, but due to development problems only a single Cray-3 was built and it was never paid for. The spiritual descendant of the Cray-2 is the Cray X1, offered by Cray.
Comparison to later computers
In 2012, Piotr Luszczek (a former doctoral student of Jack Dongarra), presented results showing that an iPad 2 matched the historical performance of the Cray-2 on an embedded LINPACK benchmark.[1]
Trivia
Due to the use of liquid cooling, the Cray-2 was given the nickname "Bubbles", and common jokes around the computer made reference to this unique system. Gags included "No Fishing" signs, cardboard depictions of the
Each vertical stack of logic modules sat above a stack of power modules which powered 5 volt busbars, each of which delivered about 2200 amps. The Cray-2 was powered by two motor-generators, which took in 480 V three-phase.
See also
References
- ^ Larabel, Michael (16 September 2012). "Apple iPad 2 As Fast As The Cray-2 Super Computer". Archived from the original on 20 February 2015. Retrieved February 19, 2015.
- ^ Kwan, J. Kelly, R, Miller G. Presentation at the American Industrial Hygiene Conference, Salt Lake City, UT, May 1991
- ^ Kelly, R. J., Personal Experience[unreliable source?]