Lead (electronics)
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In
heatsink. The tiny leads coming off through-hole electronic components are also often called pins[citation needed]; in ball grid array packages, they are in form of small spheres, and are therefore called "balls"
.
Many electrical components such as
capacitors, resistors, and inductors have only two leads, while some integrated circuits can have several hundred or even more than a thousand for the largest ball grid array
packages. Integrated circuit pins often either bend under the package body like a letter "J" (J-lead) or come out, down, and form a flat foot for securing to the board (S-lead or gull-lead).
_package_sideview.PNG)
Most kinds of
Quad Flat No‑leads package
.
The lead frame (and therefore the pins, if any, formed from that lead frame) are occasionally made from
coefficient of thermal expansion
.
Electrical effects
For many circuit designs it can be assumed that the leads do not contribute to the electrical effects of individual components. However, this assumption begins to break down at higher
resistances along each lead. Because the impedance of each component is a function of the frequency of the signals being passed through the device and the inductance and capacitance of the device, the leads can cause substantial variation in the properties of components in radio frequency
circuits.
See also
References
- ^ Freescale. "Lead Frame Packaging Technology"
- ^ Shinko. "IC Package Lead Frame"