Interposer

Source: Wikipedia, the free encyclopedia.
BGA with an interposer between the integrated circuit die to ball grid array
Pentium II: example of an interposer in dark yellow, integrated circuit die to ball grid array chip carrier

An interposer is an electrical interface routing between one socket or connection and another. The purpose of an interposer is to spread a connection to a wider pitch or to reroute a connection to a different connection.[1]

An interposer can be made of either silicon or organic (printed circuit board-like) material.[2][3]

Interposer comes from the Latin word interpōnere, meaning "to put between".[4] They are often used in BGA packages, multi-chip modules and high-bandwidth memory.[5]

A common example of an interposer is an

NoC technology, which combines small dies ("chiplets"), fabricated at the FDSOI 28 nm node, on a 65 nm CMOS interposer.[12]

Another example of an interposer is the adapter used to plug a

SAS backplane with redundant ports. While SAS drives have two ports that can be used to connect to redundant paths or storage controllers, SATA drives only have a single port. Directly, they can only connect to a single controller or path. SATA drives can be connected to nearly all SAS backplanes without adapters, but using an interposer with a port-switching logic allows providing path redundancy.[13]

See also

References

  1. ^ a b Package Substrates/Interposers.
  2. ^ "TSMC to Expand CoWoS Capacity by 60% Yearly Through 2026".
  3. ^ "Highlights of the TSMC Technology Symposium 2021 – Packaging".
  4. ^ interposes - definition of interposes by the Free Online Dictionary, Thesaurus and Encyclopedia.
  5. ^ "2.5D".
  6. ^ Silicon interposers: building blocks for 3D-ICs (Archived 2018-01-30 at the Wayback Machine) / ElectroIQ, 2011.
  7. ^ 2.5D Interposers; Organics vs. Silicon vs. Glass (Archived 2015-10-10 at the Wayback Machine) / Rao R. Tummala, ChipScaleReview, Volume 13, Number 4, July–August 2013, pages 18–19.
  8. ISBN 978-0-7918-4461-8
    .
  9. ^ "SEMICON Singapore 3D IC Wrap-Up: Bring down the cost and bring out the TSV alternatives". 3D InCites. 2013-05-22. Retrieved 2017-08-21.
  10. ^ "The AMD Radeon R9 Fury X Review: Aiming For the Top". Retrieved 2017-08-17.
  11. ^ "White Paper: Virtex-7 FPGAs" (PDF).
  12. ^ "Leti Unveils New 3D Network-on-Chip". EE Times. Archived from the original on 2016-07-15. Retrieved 2017-08-17.
  13. ^ Willis Whittington (2007). "Desktop, Nearline & Enterprise Disk Drives" (PDF). Storage Networking Industry Association (SNIA). p. 17. Retrieved 2014-09-22.


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