List of AMD Ryzen processors

Matisse (3000 series, Zen 2 based)

Common features of Ryzen 3000 desktop CPUs:

• Socket: AM4.
• All the CPUs support DDR4-3200 in dual-channel mode.
• L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
• L2 cache: 512 KB per core.
• All the CPUs support 24 PCIe 4.0 lanes. 4 of the lanes are reserved as link to the chipset.
• No integrated graphics.
• Fabrication process: TSMC 7FF.

Castle Peak (Threadripper 3000 series, Zen 2 based)

Common features of Ryzen 3000 HEDT/workstation CPUs:

• Socket:
  sWRX8
  (Threadripper PRO).
• Threadripper CPUs support DDR4-3200 in quad-channel mode while Threadripper PRO CPUs support DDR4-3200 in octa-channel mode.
• L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
• L2 cache: 512 KB per core.
• Threadripper CPUs support 64 PCIe 4.0 lanes while Threadripper PRO CPUs support 128 PCIe 4.0 lanes. 8 of the lanes are reserved as link to the chipset.
• No integrated graphics.
• Fabrication process: TSMC 7FF.

Ryzen 4000 series

Renoir (4000 series, Zen 2 based)

Based on the Ryzen 4000G series APUs with the

• Socket: AM4.
• All the CPUs support DDR4-3200 in dual-channel mode.
• L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
• L2 cache: 512 KB per core.
• All the CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
• No integrated graphics.
• Fabrication process: TSMC 7FF.
• Bundled with AMD Wraith Stealth

The AMD 4700S and 4800S desktop processors are part of a "desktop kit" that comes bundled with a motherboard and

Renoir (4000 series with Radeon Graphics, Zen 2/GCN5 based)

Common features of Ryzen 4000 desktop APUs:

• Socket: AM4.
• All the CPUs support DDR4-3200 in dual-channel mode.
• L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
• L2 cache: 512 KB per core.
• All the CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
• Includes integrated GCN 5th generation GPU.
• Fabrication process: TSMC 7FF.

Ryzen 5000 series

Vermeer (5000 series, Zen 3 based)

Common features of Ryzen 5000 desktop CPUs:

• Socket: AM4.
• All the CPUs support DDR4-3200 in dual-channel mode.
• L1 cache: 64 KB per core (32 KB data + 32 KB instruction).
• L2 cache: 512 KB per core.
• All the CPUs support 24 PCIe 4.0 lanes. 4 of the lanes are reserved as link to the chipset.
• No integrated graphics.
• Fabrication process: TSMC 7FF.

Cezanne (5000 series, Zen 3 based)

Cezanne based CPUs that have the

• Socket: AM4.
• CPUs support DDR4-3200 in dual-channel mode.
• L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
• L2 cache: 512 KB per core.
• CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
• No integrated graphics.
• Fabrication process: TSMC 7FF.

Cezanne (5000 series with Radeon Graphics, Zen 3/GCN5 based)

Common features of Ryzen 5000 desktop APUs:

• Socket: AM4.
• All the CPUs support DDR4-3200 in dual-channel mode.
• L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
• L2 cache: 512 KB per core.
• All the CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
• Includes integrated GCN 5th generation GPU.
• Fabrication process: TSMC 7FF.

Chagall (Threadripper 5000 series, Zen 3 based)

Common features of Ryzen 5000 workstation CPUs:

• Socket:
  sWRX8
  .
• All the CPUs support DDR4-3200 in octa-channel mode.
• L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
• L2 cache: 512 KB per core.
• All the CPUs support 128 PCIe 4.0 lanes. 8 of the lanes are reserved as link to the chipset.
• No integrated graphics.
• Fabrication process: TSMC 7FF.

Ryzen 7000 series

Raphael (7000 series, Zen 4/RDNA2 based)

Common features of Ryzen 7000 desktop CPUs:

• Socket: AM5.
• All the CPUs support DDR5-5200 in dual-channel mode.
• L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
• L2 cache: 1 MB per core.
• All the CPUs support 28 PCIe 5.0 lanes. 4 of the lanes are reserved as link to the chipset.
• Includes integrated RDNA 2 GPU on the I/O die with 2 CUs and clock speeds of 400 MHz (base), 2.2 GHz (boost)^[i]. Models with "F" suffixes are without iGPUs.
• Fabrication process: TSMC N5 FinFET (N6 FinFET for the I/O die).

Storm Peak (Threadripper 7000 series, Zen 4 based)

Common features of Ryzen 7000 HEDT/workstation CPUs:

• Socket:
  sTR5
  .
• Threadripper CPUs support DDR5-5200 in quad-channel mode while Threadripper PRO CPUs support DDR5-5200 in octa-channel mode with ECC support.
• L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
• L2 cache: 1 MB per core.
• Threadripper CPUs support 48
  PCIe 4.0
  lanes while Threadripper PRO CPUs support 128 PCIe 5.0 lanes. In addition, all processor models have 4 PCIe 4.0 lanes reserved as link to the chipset.
• No integrated graphics.
• Fabrication process: TSMC 5FF.

Ryzen 8000 series

Phoenix (8000 series, Zen 4 based)

Common features of Ryzen 8000 desktop CPUs:

• Socket: AM5.
• All the CPUs support DDR5-5200 RAM in dual-channel mode.
• L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
• L2 cache: 1 MB per core.
• All the CPUs support 20
  PCIe 4.0
  lanes. 4 of the lanes are reserved as link to the chipset.
• No integrated graphics.
• Fabrication process: TSMC 4 nm FinFET.

Phoenix (8000 series with Radeon Graphics, Zen 4/RDNA3/XDNA based)

Common features of Ryzen 8000G desktop APUs:

• Socket: AM5.
• All the CPUs support DDR5-5200 RAM in dual-channel mode.
• L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
• L2 cache: 1 MB per core.
• Models with Zen 4c cores (codenamed Phoenix 2) support 14 PCIe 4.0 lanes, while models without them support 20 lanes. 4 of the lanes are reserved as link to the chipset.
• Includes integrated RDNA 3 GPU.
• Includes XDNA AI Engine (Ryzen AI) on upper end models as indicated in table below.
• Fabrication process: TSMC 4 nm FinFET.

Mobile processors

Ryzen 2000 series

Raven Ridge (Zen/GCN5 based)

Common features of Ryzen 2000 notebook APUs:

• Socket: FP5.
• The U-series CPUs support DDR4-2400 in dual-channel mode, while the H-series CPUs support it at DDR4-3200 speeds.
• L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
• L2 cache: 512 KB per core.
• All the CPUs support 12 PCIe 3.0 lanes.
• Includes integrated GCN 5th generation GPU.
• Fabrication process: GlobalFoundries 14LP.

1. ^ Branded as Radeon Vega instead of Radeon RX Vega on the PRO CPUs.
2. ^ ^{a b c} Model also available as PRO version as 2300U, 2500U, 2700U, released on May 15, 2018.

Ryzen 3000 series

Dalí (Zen/GCN5 based)

Common features of Ryzen 3000 notebook APUs:

• Socket: FP5.
• All the CPUs support DDR4-2400 in dual-channel mode.
• L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
• L2 cache: 512 KB per core.
• All the CPUs support 12 PCIe 3.0 lanes.
• Includes integrated GCN 5th generation GPU.
• Fabrication process: GlobalFoundries 14LP.

Branding and Model		CPU					GPU				TDP	Release date
		Cores (threads)	GHz )		L3 cache (total)	Core config[i]	Model	Clock (GHz)	Config[ii]	Processing power ( GFLOPS)[iii]
			Base	Boost
Ryzen 3	3250U	2 (4)	2.6	3.5	4 MB	1 × 2	Vega 3	1.2	192:12:4 3 CUs	460.8	12–25 W	Jan 6, 2020
	3250C											Sep 22, 2020
	3200U											Jan 6, 2019

• v
• t
• e

1. ^ Core Complexes (CCX) × cores per CCX
2. ^ Unified Shaders : Texture Mapping Units : Render Output Units and Compute Units (CU)
3. FMA
   operation.

Picasso (Zen+/GCN5 based)

Common features of Ryzen 3000 notebook APUs:

• Socket: FP5.
• All the CPUs support DDR4-2400 in dual-channel mode.
• L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
• L2 cache: 512 KB per core.
• All the CPUs support 16 PCIe 3.0 lanes.
• Includes integrated GCN 5th generation GPU.
• Fabrication process: GlobalFoundries 12LP (14LP+).

Branding and Model		CPU					GPU				TDP	Release date
		Cores (threads)	GHz )		L3 cache (total)	Core config[i]	Model	Clock (GHz)	Config[ii]	Processing power ( GFLOPS)[iii]
			Base	Boost
Ryzen 7	3780U[56]	4 (8)	2.3	4.0	4 MB	1 × 4	RX Vega 11	1.4	704:44:16 11 CU	1971.2	15 W	Oct 2019
	3750H[57]						RX Vega 10		640:40:16 10 CU[58]	1792.0	35 W	Jan 6, 2019
	3700C[59]										15 W	Sep 22, 2020
	3700U[a][60]											Jan 6, 2019
Ryzen 5	3580U[61]		2.1	3.7			Vega 9	1.3	576:36:16 9 CU	1497.6		Oct 2019
	3550H[62]						Vega 8	1.2	512:32:16 8 CU[63]	1228.8	35 W	Jan 6, 2019
	3500C[64]										15 W	Sep 22, 2020
	3500U[a][65]											Jan 6, 2019
	3450U[66]			3.5								Jun 2020
Ryzen 3	3350U[67]	4 (4)					Vega 6		384:24:8 6 CU[68]	921.6		Jan 6, 2019
	3300U[a][69]

• v
• t
• e

1. ^ Core Complexes (CCX) × cores per CCX
2. ^ Unified Shaders : Texture Mapping Units : Render Output Units and Compute Units (CU)
3. FMA
   operation.

1. ^ ^{a b c} Model also available as PRO version^[70][71][72], released April 8, 2019.

Ryzen 4000 series

Renoir (Zen 2/GCN5 based)

Common features of Ryzen 4000 notebook APUs:

• Socket: FP6.
• All the CPUs support
  LPDDR4-4266 in dual-channel
  mode.
• L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
• L2 cache: 512 KB per core.
• All the CPUs support 16 PCIe 3.0 lanes.
• Includes integrated GCN 5th generation GPU.
• Fabrication process: TSMC 7FF.

Branding and Model		CPU					GPU				TDP	Release date
		Cores (threads)	Clock rate (GHz)		L3 cache (total)	Core config[i]	Model	Clock (GHz)	Config[ii]	Processing power ( GFLOPS)[iii]
			Base	Boost
Ryzen 9	4900H	8 (16)	3.3	4.4	8 MB	2 × 4	Radeon Graphics [a]	1.75	512:32:8 8 CU	1792	35–54 W	Mar 16, 2020
	4900HS		3.0	4.3							35 W
Ryzen 7	4800H[73]		2.9	4.2				1.6	448:28:8 7 CU	1433.6	35–54 W
	4800HS										35 W
	4980U[b]		2.0	4.4				1.95	512:32:8 8 CU	1996.8	10–25 W	Apr 13, 2021
	4800U		1.8	4.2				1.75		1792		Mar 16, 2020
	4700U[c]	8 (8)	2.0	4.1				1.6	448:28:8 7 CU	1433.6
Ryzen 5	4600H[74]	6 (12)	3.0	4.0		2 × 3		1.5	384:24:8 6 CU	1152	35–54 W
	4600HS[75]										35 W
	4680U[b]		2.1						448:28:8 7 CU	1344	10–25 W	Apr 13, 2021
	4600U[c]								384:24:8 6 CU	1152		Mar 16, 2020
	4500U	6 (6)	2.3
Ryzen 3	4300U[c]	4 (4)	2.7	3.7	4 MB	1 × 4		1.4	320:20:8 5 CU	896

• v
• t
• e

1. ^ Core Complexes (CCX) × cores per CCX
2. ^ Unified shaders : texture mapping units : render output units and compute units (CU)
3. FMA
   operation.

1. ^ All of the iGPUs are branded as AMD Radeon Graphics.
2. ^ ^{a b} Only found on the Microsoft Surface Laptop 4.
3. ^ ^{a b c} Model also available as PRO version as 4450U,^[76] 4650U,^[77] 4750U,^[78] released May 7, 2020.

Ryzen 5000 series

Lucienne (Zen 2/GCN5 based)

Common features of Ryzen 5000 notebook APUs:

• Socket: FP6.
• All the CPUs support
  LPDDR4-4266 in dual-channel
  mode.
• L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
• L2 cache: 512 KB per core.
• All the CPUs support 16 PCIe 3.0 lanes.
• Includes integrated GCN 5th generation GPU.
• Fabrication process: TSMC 7FF.

Branding and Model		CPU					GPU				TDP	Release date
		Cores (threads)	GHz )		L3 cache (total)	Core config[i]	Model	Clock (GHz)	Config[ii]	Processing power ( GFLOPS)[iii]
			Base	Boost
Ryzen 7	5700U	8 (16)	1.8	4.3	8 MB	2 × 4	Radeon Graphics [a]	1.9	512:32:8 8 CU	1945.6	10–25 W	Jan 12, 2021
Ryzen 5	5500U[79]	6 (12)	2.1	4.0		2 × 3		1.8	448:28:8 7 CU	1612.8
Ryzen 3	5300U	4 (8)	2.6	3.8	4 MB	1 × 4		1.5	384:24:8 6 CU	1152

• v
• t
• e

1. ^ Core Complexes (CCX) × cores per CCX
2. ^ Unified shaders : texture mapping units : render output units and compute units (CU)
3. FMA
   operation.

1. ^ All of the iGPUs are branded as AMD Radeon Graphics.

Cezanne and Barceló (Zen 3/GCN5 based)

Cezanne (2021 models), Barceló (2022 models). Common features of Ryzen 5000 notebook APUs:

• Socket: FP6.
• All the CPUs support
  LPDDR4-4266 in dual-channel
  mode.
• L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
• L2 cache: 512 KB per core.
• All the CPUs support 16 PCIe 3.0 lanes.
• Includes integrated GCN 5th generation GPU.
• Fabrication process: TSMC 7FF.

Branding and model		CPU					GPU				TDP	Release date
		Cores (threads)	Clock rate (GHz)		L3 cache (total)	Core config[i]	Model	Clock (GHz)	Config[ii]	Processing power (GFLOPS)[iii]
			Base	Boost
Ryzen 9	5980HX	8 (16)	3.3	4.8	16 MB	1 × 8	Radeon Graphics[a]	2.1	512:32:8 8 CUs	2150.4	35–54 W	Jan 12, 2021
	5980HS		3.0								35 W
	5900HX		3.3	4.6							35–54 W
	5900HS		3.0								35 W
Ryzen 7	5800H[80]		3.2	4.4				2.0		2048	35–54 W
	5800HS		2.8								35 W
	5825U[b][c]		2.0	4.5							15 W	Jan 4, 2022
	5800U[b]		1.9	4.4							10–25 W	Jan 12, 2021
Ryzen 5	5600H[90]	6 (12)	3.3	4.2		1 × 6		1.8	448:28:8 7 CUs	1612.8	35–54 W
	5600HS		3.0								35 W
	5625U[b][c]		2.3	4.3							15 W	Jan 4, 2022
	5600U[b]			4.2							10–25 W	Jan 12, 2021
	5560U			4.0	8 MB			1.6	384:24:8 6 CUs	1228.8
	5500H	4 (8)	3.3	4.2		1 × 4		1.8		1382.4	35–54 W	Jun 23, 2023
Ryzen 3	5425U[b][c]		2.3	4.3				1.6		1228.8	15 W	Jan 4, 2022
	5400U[b][91]		2.7	4.1							10–25 W	Jan 12, 2021
	5125C	2 (4)	3.0	—		1 × 2		1.2	192:12:8 3 CUs	460.8	15 W	May 5, 2022

• v
• t
• e

1. ^ Core Complexes (CCX) × cores per CCX
2. ^ Unified shaders : texture mapping units : render output units and compute units (CU)
3. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

1. ^ All of the iGPUs are branded as AMD Radeon Graphics.
2. ^ ^{a b c d e f} Model also available as PRO version as 5450U,^[81] 5650U,^[82] 5850U,^[83] released on March 16, 2021 and as 5475U,^[84] 5675U,^[85] 5875U,^[86] released on April 19, 2022.
3. ^ ^{a b c} Model also available as Chromebook optimized version as 5425C,^[87] 5625C,^[88] 5825C,^[89] released on May 5, 2022.

Ryzen 6000 series

Rembrandt (Zen 3+/RDNA2 based)

Common features of Ryzen 6000 notebook APUs:

• Socket: FP7, FP7r2.
• All the CPUs support
  LPDDR5-6400 in dual-channel
  mode.
• L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
• L2 cache: 512 KB per core.
• All the CPUs support 16 PCIe 4.0 lanes.
• Includes integrated RDNA 2 GPU.
• Fabrication process: TSMC 6 nm FinFET.

Branding and model		CPU					GPU				TDP	Release date
		Cores (threads)	Clock (GHz)		L3 cache (total)	Core config[i]	Model	Clock (GHz)	Config[ii]	Processing power (GFLOPS)[iii]
			Base	Boost
Ryzen 9	6980HX	8 (16)	3.3	5.0	16 MB	1 × 8	680M	2.4	768:48:8 12 CUs	3686.4	45 W	Jan 4, 2022 [92]
	6980HS										35 W
	6900HX[a]			4.9							45 W
	6900HS[a]										35 W
Ryzen 7	6800H[a]		3.2	4.7				2.2		3379.2	45 W
	6800HS[a]										35 W
	6800U[a]		2.7								15–28 W
Ryzen 5	6600H[a]	6 (12)	3.3	4.5		1 × 6	660M	1.9	384:24:8 6 CUs	1459.2	45 W
	6600HS[a]										35 W
	6600U[a]		2.9								15–28 W

• v
• t
• e

1. ^ Core Complexes (CCX) × cores per CCX
2. ^ Unified shaders : texture mapping units : render output units and compute units (CU)
3. FMA
   operation.

1. ^ ^{a b c d e f g h} Model also available as PRO version (6650U^[93], 6650H^[94], 6650HS^[95], 6850U^[96], 6850H^[97], 6850HS^[98], 6950H^[99], 6950HS^[100]), released on April 19, 2022.

New naming scheme for future mobile processors

The table below denotes the naming scheme for AMD's mobile CPU lineups starting with the 7000 series.^[101]

Portfolio model number	Market segment	Architecture	Feature isolation (if needed)	Form factor/TDP
7xxx -> 2023 8xxx -> 2024 9xxx -> 2025 etc.	x1xx -> Athlon Silver x2xx -> Athlon Gold x3xx -> Ryzen 3 x4xx -> Ryzen 3 x5xx -> Ryzen 5 x6xx -> Ryzen 5 x7xx -> Ryzen 7 x8xx -> Ryzen 7/9 x9xx -> Ryzen 9 There are some exceptions, such as the Ryzen 5 7235HS	xx1x -> Zen 1/1+ xx2x -> Zen 2 xx3x -> Zen 3/3+ xx4x -> Zen 4 xx5x -> Zen 5 etc.	xxx0 -> Lower model within segment (variants may use 1-4) xxx5 -> Upper model within segment (variants may use 6-9)	HX -> 55W+ (Max Performance) HS -> ~35W+ (Thin Gaming/Creator) U -> 15-28W (Premium Ultrathin) C -> 15-28W (Chromebook) e -> 9W (Fanless variant of "U")

Ryzen 7000 series

Mendocino (7020 series, Zen 2/RDNA2 based)

Common features of Ryzen 7020 notebook APUs:

• Socket: FT6
• All the CPUs support
  LPDDR5-5500 in dual-channel
  mode.
• L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
• L2 cache: 512 KB per core.
• All the CPUs support 4 PCIe 3.0 lanes.
• Includes integrated RDNA 2 GPU.
• Fabrication process:
  6 nm
  FinFET.

Branding and Model		CPU					GPU			TDP	Release date
		Cores (threads)	GHz )		L3 cache (total)	Core config[i]	Model	Clock (GHz)	Processing power[ii] (GFLOPS)
			Base	Boost
Ryzen 5	7520U[iii]	4 (8)	2.8	4.3	4 MB	1 × 4	610M 2 CU	1.9	486.4	15 W	September 20, 2022[102]
Ryzen 3	7320U[iii]		2.4	4.1

• v
• t
• e

1. ^ Core Complexes (CCX) × cores per CCX
2. FMA
   operation.
3. ^ ^{a b} Model also available as Chromebook optimized version as 7520C^[103] and 7320C^[104] released on May 23, 2023

Barcelo-R (7030 series, Zen 3/GCN5 based)

Common features of Ryzen 7030 notebook APUs:

• Socket: FP6.
• All the CPUs support
  LPDDR4-4266 in dual-channel
  mode.
• L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
• L2 cache: 512 KB per core.
• All the CPUs support 16 PCIe 3.0 lanes.
• Includes integrated GCN 5th generation GPU.
• Fabrication process: TSMC 7nm FinFET.

Branding and Model		CPU					GPU			TDP	Release date
		Cores (threads)	Clock rate (GHz)		L3 cache (total)	Core config[a]	Model	Clock (GHz)	Processing power[b] (GFLOPS)
			Base	Boost
Ryzen 7	(PRO) 7730U	8 (16)	2.0	4.5	16 MB	1 × 8	Vega 8 CU	2.0	2048	15 W	January 4, 2023 [105]
Ryzen 5	(PRO) 7530U	6 (12)				1 × 6	Vega 7 CU		1792
Ryzen 3	(PRO) 7330U	4 (8)	2.3	4.3	8 MB	1 × 4	Vega 6 CU	1.8	1382.4

• v
• t
• e

1. ^ Core Complexes (CCX) × cores per CCX
2. FMA
   operation.

Rembrandt-R (7035 series, Zen 3+/RDNA2 based)

Common features of Ryzen 7035 notebook APUs:

• Socket: FP7, FP7r2.
• All the CPUs support
  LPDDR5-6400 in dual-channel
  mode.
• L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
• L2 cache: 512 KB per core.
• All the CPUs support 16 PCIe 4.0 lanes.
• Includes integrated RDNA 2 GPU.
• Fabrication process: TSMC 6 nm FinFET.

Branding and model		CPU					GPU			TDP	Release date[106]
		Cores (threads)	Clock (GHz)		L3 cache (total)	Core config[a]	Model	Clock (GHz)	Processing power[b] (GFLOPS)
			Base	Boost
Ryzen 7	7735HS	8 (16)	3.2	4.75	16 MB	1 × 8	680M 12 CU	2.2	3379.2	35–54 W	April 30, 2023
	7735H
	7736U		2.7	4.7						15–28 W	January 4, 2023
	7735U			4.75						15–30 W
	7435HS		3.1	4.5			—			35–54 W	2024[107]
	7435H
Ryzen 5	7535HS	6 (12)	3.3	4.55		1 × 6	660M 6 CU	1.9	1459.2		April 30, 2023
	7535H
	7535U		2.9							15–30 W	January 4, 2023
	7235HS	4 (8)	3.2	4.2	8 MB	1 × 4	—			35–53 W	2024[108]
	7235H
Ryzen 3	7335U		3.0	4.3			660M 4 CU	1.8	921.6	15–30 W	January 4, 2023

• v
• t
• e

1. ^ Core Complexes (CCX) × cores per CCX
2. FMA
   operation.

Phoenix (7040 series, Zen 4/RDNA3/XDNA based)

Common features of Ryzen 7040 notebook APUs:

• Socket: FP7, FP7r2, FP8.
• All the CPUs support DDR5-5600 or LPDDR5X-7500 in dual-channel mode.
• L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
• L2 cache: 1 MB per core.
• All the CPUs support 20 PCIe 4.0 lanes.
• Includes integrated RDNA 3 GPU.
• Includes XDNA AI Engine (Ryzen AI).
• Fabrication process: TSMC 4 nm FinFET.

Branding and model		CPU					GPU		NPU	TDP	Release date[109]
		Cores (threads)	Clock (GHz)		L3 cache (total)	Core config[a]	Model	Clock (GHz)
			Base	Boost
Ryzen 9	(PRO) 7940HS	8 (16)	4.0	5.2	16 MB	1 × 8	780M 12 CU	2.8	Ryzen AI Up to 10 TOPS	35–54 W	April 30, 2023[b]
	7940H[c]
Ryzen 7	(PRO) 7840HS		3.8	5.1				2.7
	7840H[c]
	(PRO) 7840U		3.3							15–30 W	May 3, 2023[b]
Ryzen 5	(PRO) 7640HS	6 (12)	4.3	5.0		1 × 6	760M 8 CU	2.6		35–54 W	April 30, 2023[b]
	7640H[c]
	(PRO) 7640U		3.5	4.9						15–30 W	May 3, 2023[b]
	(PRO) 7545U		3.2			2 + 4	740M 4 CU	2.8	No		November 2, 2023
	(PRO) 7540U					1 × 6		2.5			May 3, 2023[b]
Ryzen 3	7440U	4 (8)	3.0	4.7	8 MB	1 + 3

• v
• t
• e

1. ^ Core Complexes (CCX) × cores per CCX or Zen 4 + Zen 4c cores
2. ^ ^{a b c d e} PRO versions launched on 13 June 2023.
3. ^
   AMD EXPO and FreeSync
   technologies.

Dragon Range (7045 series, Zen 4/RDNA2 based)

Common features of Ryzen 7045 notebook CPUs:

• Socket: FL1.
• All the CPUs support DDR5-5200 in dual-channel mode.
• L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
• L2 cache: 1 MB per core.
• All the CPUs support 28 PCIe 5.0 lanes.
• Includes integrated RDNA 2 GPU on the I/O die with 2 CUs and clock speeds of 400 MHz (base), 2.2 GHz (boost)^[i].
• Fabrication process: TSMC 5 nm FinFET (6 nm FinFET for the I/O and graphics die).

Branding and model		Cores (threads)	Clock (GHz)		L3 cache (total)	Chiplets	Core config[a]	TDP	Release date
			Base	Boost
Ryzen 9	7945HX3D	16 (32)	2.3	5.4	128 MB[ii]	2 × CCD 1 × I/OD	2 × 8	55–75 W	July 27, 2023
	7945HX		2.5		64 MB				February 28, 2023 [110]
	7845HX	12 (24)	3.0	5.2			2 × 6	45–75 W
Ryzen 7	7745HX	8 (16)	3.6	5.1	32 MB	1 × CCD 1 × I/OD	1 × 8
Ryzen 5	7645HX	6 (12)	4.0	5.0			1 × 6

• v
• t
• e

1. ^ Core Complexes (CCX) × cores per CCX

1. ^ Self identifies as "AMD Radeon 610M". See RDNA 2 § Integrated graphics processors (iGPs).
2. ^ Only one of the two CCXes has additional 64 MB of 3D V-Cache. Only the CCX without 3D V-Cache will be able to reach the maximum boost clocks. The CCX with 3D V-Cache will clock lower.

Ryzen 8000 series

Hawk Point (8040 series, Zen 4/RDNA3/XDNA based)

Common features of Ryzen 8040 notebook APUs:

• Socket: FP7, FP7r2, FP8.
• All the CPUs support DDR5-5600 or LPDDR5X-7500 in dual-channel mode.
• L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
• L2 cache: 1 MB per core.
• All the CPUs support 20 PCIe 4.0 lanes.
• Includes integrated RDNA 3 GPU.
• Includes XDNA AI Engine (Ryzen AI).
• Fabrication process: TSMC 4 nm FinFET.

Branding and model		CPU					GPU		NPU	TDP	Release date
		Cores (threads)	Clock (GHz)		L3 cache (total)	Core config[a]	Model	Clock (GHz)
			Base	Boost
Ryzen 9	8945HS	8 (16)	4.0	5.2	16 MB	1 × 8	780M 12 CU	2.8	Ryzen AI Up to 16 TOPS	35–54 W	December 6, 2023[111]
Ryzen 7	8845HS		3.8	5.1				2.7
	8840HS		3.3							20–30 W
	8840U									15–30 W
Ryzen 5	8645HS	6 (12)	4.3	5.0		1 × 6	760M 8 CU	2.6		35–54 W
	8640HS		3.5	4.9						20–30 W
	8640U									15–30 W
	8540U		3.2			2 + 4	740M 4 CU	2.8	No
Ryzen 3	8440U	4 (8)	3.0	4.7	8 MB	1 + 3		2.5

• v
• t
• e

1. ^ Core Complexes (CCX) × cores per CCX or Zen 4 + Zen 4c cores

Handheld gaming PC processors

Ryzen Z1 series (Zen 4/RDNA3 based)

Common features of Ryzen Z1 handheld APUs:

• Socket: FP7, FP7r2, FP8.
• All the CPUs support
  LPDDR5X-7500 in dual-channel
  mode.
• L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
• L2 cache: 1 MB per core.
• All the CPUs support 20 PCIe 4.0 lanes.
• Includes integrated RDNA 3 GPU.
• Fabrication process: TSMC 4 nm FinFET.

Branding and model		CPU					GPU		TDP	Release date
		Cores (threads)	Clock (GHz)		L3 cache (total)	Core config[a]	Model	Clock (GHz)
			Base	Boost
Ryzen	Z1 Extreme	8 (16)	3.3	5.1	16 MB	1 × 8	780M 12 CU	2.7	9–30 W	May 2023[112]
	Z1	6 (12)	3.2	4.9		2 + 4	740M 4 CU	2.5

• v
• t
• e

1. ^ Core Complexes (CCX) × cores per CCX or Zen 4 + Zen 4c cores

Embedded processors

1000 series

Great Horned Owl (V1000 series, Zen/GCN5 based)

Model	Release date	Fab	CPU						GPU				Memory support	TDP	Junction temp. range (°C)
			Cores (threads)	GHz )		Cache			Model	Config[i]	Clock (GHz)	Processing power ( GFLOPS)[ii]
				Base	Boost	L1	L2	L3
V1202B	February 2018	GloFo 14LP	2 (4)	2.3	3.2	64 KB inst. 32 KB data per core	512 KB per core	4 MB	Vega 3	192:12:16 3 CU	1.0	384	DDR4-2400 dual-channel	12–25 W	0–105
V1404I	December 2018		4 (8)	2.0	3.6				Vega 8	512:32:16 8 CU	1.1	1126.4			-40–105
V1500B				2.2	—				—						0–105
V1605B	February 2018			2.0	3.6				Vega 8	512:32:16 8 CU	1.1	1126.4
V1756B				3.25									DDR4-3200 dual-channel	35–54 W
V1780B	December 2018			3.35					—
V1807B	February 2018				3.8				Vega 11	704:44:16 11 CU	1.3	1830.4

• v
• t
• e

1. ^ Unified Shaders : Texture Mapping Units : Render Output Units and Compute Units (CU)
2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

Banded Kestrel (R1000 series, Zen/GCN5 based)

Model	Release date	Fab	CPU						GPU				Memory support	TDP
			Cores (threads)	GHz )		Cache			Model	Config[i]	Clock (GHz)	Processing power ( GFLOPS)[ii]
				Base	Boost	L1	L2	L3
R1102G	February 25, 2020	GloFo 14LP	2 (2)	1.2	2.6	64 KB inst. 32 KB data per core	512 KB per core	4 MB	Vega 3	192:12:4 3 CU	1.0	384	DDR4-2400 single-channel	6 W
R1305G			2 (4)	1.5	2.8								DDR4-2400 dual-channel	8-10 W
R1505G	April 16, 2019			2.4	3.3									12–25 W
R1606G				2.6	3.5						1.2	460.8

• v
• t
• e

1. ^ Unified Shaders : Texture Mapping Units : Render Output Units and Compute Units (CU)
2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

2000 series

Grey Hawk (V2000 series, Zen 2/GCN5 based)

Model	Release date	Fab	CPU						GPU				Socket	PCIe support	Memory support	TDP
			Cores (threads)	Clock rate (GHz)		Cache			Archi- tecture	Config[i]	Clock (GHz)	Processing power[ii] (GFLOPS)
				Base	Boost	L1	L2	L3
V2516[113]	November 10, 2020[114]	TSMC 7FF	6 (12)	2.1	3.95	32 KB inst. 32 KB data per core	512 KB per core	8 MB	GCN 5	384:24:8 6 CU	1.5	1152	FP6	20 (8+4+4+4) PCIe 3.0	DDR4-3200 dual-channel LPDDR4X-4266 quad-channel	10–25 W
V2546[113]				3.0	3.95											35–54 W
V2718[113]			8 (16)	1.7	4.15					448:28:8 7 CU	1.6	1433.6				10–25 W
V2748[113]				2.9	4.25											35–54 W

• v
• t
• e

1. ^ Unified Shaders : Texture Mapping Units : Render Output Units and Compute Units (CU)
2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

River Hawk (R2000 series, Zen+ based)

This section needs expansion. You can help by adding to it. (March 2023)

3000 series

(V3000 series, Zen 3+ based)

Model	Release date	Fab	CPU						Socket	PCIe support	Memory support	TDP
			Cores (threads)	Clock rate (GHz)		Cache
				Base	Boost	L1	L2	L3
V3C14[115][116]	September 27, 2022[117]	TSMC 7FF	4 (8)	2.3	3.8	32 KB inst. 32 KB data per core	512 KB per core	8 MB	FP7r2	20 (8+4+4+4) PCIe 4.0	DDR5-4800 dual-channel	15 W
V3C44[115][116]				3.5	3.8							45 W
V3C16[115][116]			6 (12)	2.0	3.8			16 MB				15 W
V3C18I[115][116]			8 (16)	1.9	3.8							15 W
V3C48[115][116]				3.3	3.8							45 W

• v
• t
• e

7000 series

(Ryzen Embedded 7000 series, Zen 4/RDNA2 based)

Common features of Ryzen Embedded 7000 series CPUs:

• Socket: AM5.
• All the CPUs support ECC DDR5-5200 dual-channel mode.
• L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
• L2 cache: 1 MB per core.
• All the CPUs support 28 PCIe 5.0 lanes. 4 of the lanes are reserved as link to the chipset.
• Includes integrated RDNA 2 GPU with 2 CUs and boost clock speeds of 2200 MHz.
• Fabrication process: TSMC N5 FinFET (N6 FinFET for the I/O die).

Processor branding	Model	Cores (threads)	Clock rate (GHz)		L3 cache (total)	Chiplets	Core config[i]	TDP	Release date
			Base	Boost
Ryzen Embedded	7945	12 (24)	3.7	5.4	64 MB	2 × CCD 1 × I/OD	2 × 6	65 W	Nov 14, 2023[118]
	7745	8 (16)	3.8	5.3	32 MB	1 × CCD 1 × I/OD	1 × 8
	7700X		4.5	5.4				105 W
	7645	6 (12)	3.8	5.1			1 × 6	65 W
	7600X		4.7	5.3				105 W

• v
• t
• e

1. ^ Core Complexes (CCX) × cores per CCX

See also

• Table of AMD processors
• List of AMD Athlon processors
• List of AMD processors with 3D graphics
• List of AMD CPU microarchitectures
• List of AMD chipsets

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