Hybrid integrated circuit
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A hybrid integrated circuit (HIC), hybrid microcircuit, hybrid circuit or simply hybrid is a miniaturized
Overview
"Integrated circuit" as the term is currently used refers to a monolithic IC which differs notably from a HIC in that a HIC is fabricated by inter-connecting a number of components on a substrate whereas an IC's (monolithic) components are fabricated in a series of steps entirely on a single wafer which is then diced into chips.[2] Some hybrid circuits may contain monolithic ICs, particularly Multi-chip module (MCM) hybrid circuits.
Hybrid circuits could be encapsulated in epoxy, as shown in the photo, or in military and space applications, a lid was soldered onto the package. A hybrid circuit serves as a component on a PCB in the same way as a monolithic integrated circuit; the difference between the two types of devices is in how they are constructed and manufactured. The advantage of hybrid circuits is that components which cannot be included in a monolithic IC can be used, e.g., capacitors of large value, wound components, crystals, inductors.[3] In military and space applications, numerous integrated circuits, transistors and diodes, in their die form, would be placed on either a ceramic or beryllium substrate. Either gold or aluminum wire would be bonded from the pads of the IC, transistor, or diode to the substrate.
Thin film technology was also employed in the 1960s. Ultra Electronics manufactured circuits using a silica glass substrate. A film of tantalum was deposited by sputtering followed by a layer of gold by evaporation. The gold layer was first etched following the application of a photoresist to form solder compatible connection pads. Resistive networks were formed, also by a photoresist and etching process. These were trimmed to a high precision by selective adonization of the film. Capacitors and semiconductors were in the form of LID (Leadless Inverted Devices) soldered to the surface by selectively heating the substrate from the underside. Completed circuits were potted in a diallyl phthalate resin. Several customized passive networks were made using these techniques as were some amplifiers and other specialized circuits. It is believed that some passive networks were used in the engine control units manufactured by Ultra Electronics for Concorde.
Some modern hybrid circuit technologies, such as
Other electronic hybrids
In the early days of telephones, separate modules containing transformers and resistors were called hybrids or
In the early days of
See also
- Chip on board, aka black blobs
- System in a package
- Multi-chip module (MCM)
- Monolithic microwave integrated circuit (MMIC)
- Solid Logic Technology (SLT)
- MIL-PRF-38534
- Printed Circuit Board (PCB)
- Printed Electronic Circuit- Ancestor of the Hybrid IC
References
- ^ "Tell me... Just what is a Hybrid Integrated Circuit?". ES Components. September 7, 2017. Retrieved 6 April 2024.
- ^ "Difference between Monolithic ICs and Hybrid ICs (integrated circuits)". Polytechnic Hub. March 2, 2017. Retrieved 6 April 2024.
- ISBN 0387339132, p.62-64